Field-Effect Semiconductor Device and a Manufacturing Method Therefor

ABSTRACT

A semiconductor device includes a semiconductor body having first and second opposite sides, a drift region, a body layer at the second side, and a field-stop region in Ohmic connection with the body layer. A source metallization at the second side is in Ohmic connection with the body layer. A drain metallization at the first side is in Ohmic connection with the drift region. A gate electrode at the second side is electrically insulated from the semiconductor body to define an operable switchable channel region in the body layer. A through contact structure extends at least between the first and second sides, and includes a conductive region in Ohmic connection with the gate electrode and a dielectric layer. In a normal projection onto a horizontal plane substantially parallel to the first side, the field-stop region surrounds at least one of the drift region and the gate electrode.

TECHNICAL FIELD

Embodiments of the present invention relate to field-effect semiconductor devices, in particular to vertical power field-effect semiconductor transistors and manufacturing methods therefor.

BACKGROUND

Semiconductor transistors, in particular field-effect controlled switching devices such as a Metal Oxide Semiconductor Field Effect Transistor (MOSFET) or an Insulated Gate Bipolar Transistor (IGBT), have been used for various applications including but not limited to use as switches in power supplies and power converters, electric cars, air-conditioners, and even stereo systems. Particularly with regard to power devices capable of switching large currents and/or operating at higher voltages, a low on-state resistance Ron and high breakdown voltages U_(bd) are often desired.

To achieve low on-state resistance Ron and high breakdown voltages U_(bd), charge-compensation semiconductor devices were developed. The compensation principle is based on a mutual compensation of charges in n- and p-doped regions, which are often also referred to as n- and p-doped pillar regions, in the drift zone of a vertical MOSFET.

Typically, the charge-compensation structure formed by p-type and n-type regions is arranged below the actual MOSFET-structure, with its source, body regions and gate regions, and also below the associated MOS-channels that are arranged next to one another in the semiconductor volume of the semiconductor device or interleaved with one another in such a way that, in the off-state, their charges can be mutually depleted and that, in the activated state or on-state, there results an uninterrupted, low-impedance conduction path from a source electrode near the surface to a drain electrode arranged on the back side.

By virtue of the compensation of the p-type and n-type dopings, the doping of the current-carrying region can be significantly increased in the case of compensation components, which results in a significant reduction of the on-state resistance Ron despite the loss of a current-carrying area. The reduction of the on-state resistance Ron of such semiconductor power devices is associated with a reduction of the heat generated by the current in the on-state, so that such semiconductor power devices with charge-compensation structure remain “cool” compared with conventional semiconductor power devices.

Many power semiconductor devices including charge-compensation devices are usually designed as vertically conducting devices and have an active area (cell area) surrounded by a peripheral area. Accordingly, the electric current in the on state flows from the source on the front side to drain at the backside of the chip. The backside is often implemented as a “common-drain”, i.e. as an equipotential surface at drain potential.

However, there are applications which are better suited for common-source devices, i.e. to devices with one side implemented as an equipotential surface at source potential during device operation, or a combination of a common-source device with a common-drain device. Example refer to automotive applications and the integration of two semiconductor chips such as a power semiconductor field-effect transistor chip and a driver chip for the transistor chip or two power semiconductor field-effect transistor chips of a half-bridge or a synchronous rectifier circuitry into a common package.

Also due to similar voltage of gate and source structures during operation, these structures are often located in immediate “neighborhood” to each other and are processed from the same wafer side, namely the front side. However, if the wafer front side should represent a common source plane, the gate connection must be rewired to the wafer back side. Particularly in the case of high-voltage components (e.g. having a blocking voltage of at least one hundred volt), an edge-termination structure may than be required on the chip rear side (or in terms of production technology on the wafer back side). Unfortunately, the structuring and processing options are rather limited on the back of the wafer compared to the front side. Accordingly, it is often difficult to achieve sufficiently high blocking voltages for those devices, at least in a cost-efficient manner. Moreover, the rewiring of the gate connection through the bulk may also have an impact on the electric field distribution during device operation.

Accordingly, there is a need to improve field-effect semiconductor devices, in particular power field-effect semiconductor devices including charge-compensation field-effect semiconductor devices and manufacturing of those semiconductor devices.

SUMMARY

According to an embodiment of a field-effect semiconductor device, the field-effect semiconductor device includes a semiconductor body including a first side, a second side opposite the first side, an n-type drift region, a p-type body layer forming a pn-junction with the drift region and arranged at the second side, and a p-type field-stop region in Ohmic connection with the body layer. A source metallization is arranged on the second side and in Ohmic connection with the body layer. A drain metallization is arranged on the first side and in Ohmic connection with the drift region. A gate electrode is arranged adjacent to the second side and electrically insulated from the semiconductor body to define an operable switchable channel region in the body layer for providing an Ohmic connection between the source metallization and the drift region. A first through contact structure extends at least between the first side and the second side, and includes a conductive region in Ohmic connection with the gate electrode, and a dielectric layer electrically insulating the conductive region from the semiconductor body. A gate metallization is arranged on the first side and in Ohmic connection with the conductive region. In a normal projection onto a horizontal plane at least substantially parallel to the first side, the field-stop region surrounds at least one of the drift region and the gate electrode.

According to an embodiment of a field-effect semiconductor device, the field-effect semiconductor device includes a semiconductor body including a first side, a second side opposite the first side, a semiconductor structure of a second conductivity type extending at least substantially from the first side to the second side, and a drift region of a first conductivity type arranged, in a vertical cross-section at least substantially perpendicular to the first side, between two portions of the semiconductor structure. A first metallization is arranged on the second side and in Ohmic connection with the semiconductor structure. A second metallization is arranged on the first side and in Ohmic connection with the drift region. A plurality of gate electrodes arranged adjacent to the second side overlap with the drift region in a normal projection onto a horizontal plane at least substantially parallel to the first side, and are electrically insulated from the semiconductor body. A first through contact structure extends at least between the first side and the second side, and includes a conductive region in Ohmic connection with the gate electrodes, and a dielectric layer electrically insulating the conductive region from the semiconductor body so that at least a portion of the semiconductor structure is, in the normal projection onto the horizontal plane, arranged between the first through contact structure and the gate electrodes. A gate pad is arranged on the first side and in Ohmic connection with the conductive region.

According to an embodiment of a method for forming a field-effect semiconductor device, the method includes providing a wafer including a semiconductor body including a first side, a second side opposite the first side, a drift region of a first conductivity type and a semiconductor structure of a second conductivity type extending from the first side to the second side, and surrounding the drift region in a normal projection onto a horizontal plane at least substantially parallel to the first side, and a first dielectric layer arranged at the first side. A first deep trench is formed from the second side at least to the dielectric layer. A dielectric sidewall layer is formed at a sidewall of the first deep trench. A conductive region is formed at the sidewall layer in the first deep trench. A plurality of gate electrodes is formed adjacent to the second side and overlapping with the drift region in the normal projection onto the horizontal plane. A first metallization is formed on the second side and in Ohmic connection with the semiconductor structure. Opposite to the first metallization, a second metallization in Ohmic connection with the drift region, and a gate metallization in Ohmic connection with the conductive region are formed.

Those skilled in the art will recognize additional features and advantages upon reading the following detailed description, and upon viewing the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The components in the figures are not necessarily to scale, instead emphasis being placed upon illustrating the principles of the invention. Moreover, in the figures, like reference numerals designate corresponding parts. In the drawings:

FIG. 1 illustrates a vertical cross-section through a semiconductor body of a field-effect semiconductor device according to an embodiment;

FIG. 2 illustrates a vertical cross-section through a semiconductor body of a field-effect semiconductor device according to an embodiment;

FIG. 3 illustrates a vertical cross-section through a semiconductor body of a field-effect semiconductor device according to an embodiment;

FIG. 4 illustrates a vertical cross-section through a semiconductor body of a field-effect semiconductor device according to an embodiment;

FIG. 5 illustrates a vertical cross-section through a semiconductor body of a field-effect semiconductor device according to an embodiment;

FIG. 6 illustrates a vertical cross-section through a semiconductor body of a field-effect semiconductor device according to an embodiment; and

FIG. 7A to FIG. 7B, FIG. 8A to FIG. 8B, and FIG. 9 to FIG. 21 illustrate vertical cross-sections through a semiconductor body during method steps of methods according to embodiments.

DETAILED DESCRIPTION

In the following Detailed Description, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. In this regard, directional terminology, such as “top,” “bottom,” “front,” “back,” “leading,” “trailing,” etc., is used with reference to the orientation of the Figure(s) being described. Because components of embodiments can be positioned in a number of different orientations, the directional terminology is used for purposes of illustration and is in no way limiting. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims.

Reference will now be made in detail to various embodiments, one or more examples of which are illustrated in the figures. Each example is provided by way of explanation, and is not meant as a limitation of the invention. For example, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the present invention includes such modifications and variations. The examples are described using specific language which should not be construed as limiting the scope of the appending claims. The drawings are not scaled and are for illustrative purposes only. For clarity, the same elements or manufacturing steps have been designated by the same references in the different drawings if not stated otherwise.

The term “horizontal” as used in this specification intends to describe an orientation substantially parallel to a first or main horizontal side of a semiconductor substrate or body, typically a respective substantially flat surface. This can be for instance the surface of a wafer or a die.

The term “vertical” as used in this specification intends to describe an orientation which is substantially arranged perpendicular to the first surface, i.e. parallel to the normal direction of the first surface of the semiconductor substrate or body. Likewise, the term “horizontal” as used in this specification intends to describe an orientation which is substantially arranged parallel to the first surface.

In this specification, a second surface of a semiconductor substrate of semiconductor body is considered to be formed by the lower or backside surface while the first surface is considered to be formed by the upper, front or main surface of the semiconductor substrate. The terms “above” and “below” as used in this specification therefore describe a relative location of a structural feature to another structural feature with consideration of this orientation.

In this specification, n-doped is referred to as first conductivity type while p-doped is referred to as second conductivity type. Alternatively, the semiconductor devices can be formed with opposite doping relations so that the first conductivity type can be p-doped and the second conductivity type can be n-doped. Furthermore, some Figures illustrate relative doping concentrations by indicating “−” or “+” next to the doping type. For example, “n⁻” means a doping concentration which is less than the doping concentration of an “n”-doping region while an “n⁺”-doping region has a larger doping concentration than the “n”-doping region. However, indicating the relative doping concentration does not mean that doping regions of the same relative doping concentration have to have the same absolute doping concentration unless otherwise stated. For example, two different n⁺-doping regions can have different absolute doping concentrations. The same applies, for example, to an n⁺-doping and a p⁺-doping region.

Specific embodiments described in this specification pertain to, without being limited thereto, to field-effect semiconductor devices, in particular to field-effect compensation semiconductor devices and manufacturing methods therefor. Within this specification the terms “semiconductor device” and “semiconductor component” are used synonymously. The field-effect semiconductor device is typically a vertical semiconductor device such as a vertical MOSFET with a drain metallization arranged on the first surface and a source metallization and an insulated gate electrode arranged on a second surface arranged opposite to the first surface. Typically, the field-effect semiconductor device is a power semiconductor device having an active area with a plurality of MOSFET-cells for carrying and/or controlling a load current. Furthermore, the power semiconductor device has typically a peripheral area with at least one edge-termination structure at least partially surrounding the active area when seen from above.

The term “power semiconductor device” as used in this specification intends to describe a semiconductor device on a single chip with high voltage and/or high current switching capabilities. In other words, power semiconductor devices are intended for high current, typically in the Ampere range and/or voltages of more than about 10 V or even more than about 100 V or about 500 V. Within this specification the terms “power semiconductor device” and “power semiconductor component” are used synonymously.

The term “edge-termination structure” as used in this specification intends to describe a structure that is configured to provide in a blocking mode a transition region in which a high electric voltage, i.e. a voltage of high absolute value compared to ground, such as a drain voltage around an active area of the semiconductor device change gradually to the potential at or close to the edge of the device and/or to a reference potential such as ground, source- or gate potential. The edge-termination structure may, for example, lower the field intensity around a termination region of a rectifying junction by spreading the electric field lines across the termination region.

The term “field-effect” as used in this specification intends to describe the electric-field mediated formation of a conductive “channel” of a first conductivity type and/or control of conductivity and/or shape of the channel in a semiconductor region of a second conductivity type, typically a body region of the second conductivity type. Due to the field-effect, a unipolar current path through the channel region is formed and/or controlled between a source region of the first conductivity type and a drift region of the first conductivity type. The drift region may be in contact with a drain region. The drift region and the drain region are typically in low Ohmic connection with a drain electrode (drain metallization). The source region is typically in low Ohmic connection with a source electrode (source metallization).

In the context of the present specification, the term “in Ohmic connection” intends to describe that there is an ohmic current path, e.g. a low-ohmic current path, between respective elements or portions of a semiconductor device when no voltages or only small probe voltages are applied to and/or across the semiconductor device. Within this specification the terms “in Ohmic connection”, “in resistive electric connection”, “electrically coupled”, and “in resistive electric connection” are used synonymously. In the context of the present specification, the term “in Ohmic contact” intends to describe that two elements or portions of a semiconductor device are in direct mechanical ((intimate physical)) contact and in Ohmic connection.

The terms “electrical connection” and “electrically connected” describes an Ohmic connection between two features.

In the context of the present specification, the term “MOS” (metal-oxide-semiconductor) should be understood as including the more general term “MIS” (metal-insulator-semiconductor). For example, the term MOSFET (metal-oxide-semiconductor field-effect transistor) should be understood to include FETs having a gate insulator that is not an oxide, i.e. the term MOSFET is used in the more general term meaning of IGFET (insulated-gate field-effect transistor) and MISFET (metal-insulator-semiconductor field-effect transistor), respectively. The term “metal” for the gate material of the MOSFET should be understood to include or comprise electrical conductive materials like e. g. metal, alloys, doped polycrystalline semiconductors and metal semiconductor compounds like metal silicides.

In the context of the present specification, the term “gate electrode” intends to describe an electrode which is situated next to, and insulated from the body region and configured to form and/or control a channel region through the body region.

In the context of the present specification, the term “field electrode” intends to describe an electrode which is arranged next to a semiconductor region, typically the drift region, partially insulated from the semiconductor region, and configured to expand a depleted portion in the semiconductor region by charging to an appropriate voltage, typically a negative voltage with regard to the surrounding semiconductor region for an n-type semiconductor region.

In the context of the present specification, the term “depletable region” or “depletable zone” is intended to describe the fact that the corresponding semiconductor region or the corresponding semiconductor zone is substantially fully depleted (substantially free of free charge carriers) during the off state of the semiconductor component with an applied reverse voltage lying above a given threshold value. For this purpose, the doping charge of the depletable region is set accordingly and, in one or more embodiments, the depletable region is a weakly doped region. In the off state, the depletable region(s) form depleted region(s), also referred to as space charge region(s), typically a contiguous depleted zone whereby the current flow between two electrodes or metallizations connected to the semiconductor body can be prevented.

In the context of the present specification, the term “mesa” or “mesa region” intends to describe a semiconductor region between two adjacent trenches extending into the semiconductor substrate or body in a vertical cross-section.

The term “pn-junction” as used in this specification intends to describe the boundary surface between adjoining semiconductor regions or semiconductor portions of different conductivity type.

In the following, embodiments pertaining to semiconductor devices and manufacturing methods for forming semiconductor devices are explained mainly with reference to silicon (Si) semiconductor devices. Accordingly, a monocrystalline semiconductor region or layer is typically a monocrystalline Si-region or Si-layer. It should, however, be understood that the semiconductor body can be made of any semiconductor material suitable for manufacturing a semiconductor device. Examples of such materials include, without being limited thereto, elementary semiconductor materials such as silicon (Si) or germanium (Ge), group IV compound semiconductor materials such as silicon carbide (SiC) or silicon germanium (SiGe), binary, ternary or quaternary III-V semiconductor materials such as gallium nitride (GaN), gallium arsenide (GaAs), gallium phosphide (GaP), indium phosphide (InP), indium gallium phosphide (InGaPa), aluminum gallium nitride (AlGaN), aluminum indium nitride (AlInN), indium gallium nitride (InGaN), aluminum gallium indium nitride (AlGaInN) or indium gallium arsenide phosphide (InGaAsP), and binary or ternary II-VI semiconductor materials such as cadmium telluride (CdTe) and mercury cadmium telluride (HgCdTe) to name few. The above mentioned semiconductor materials are also referred to as homojunction semiconductor materials. When combining two different semiconductor materials a heterojunction semiconductor material is formed. Examples of heterojunction semiconductor materials include, without being limited thereto, aluminum gallium nitride (AlGaN)-aluminum gallium indium nitride (AlGaInN), indium gallium nitride (InGaN)-aluminum gallium indium nitride (AlGaInN), indium gallium nitride (InGaN)-gallium nitride (GaN), aluminum gallium nitride (AlGaN)-gallium nitride (GaN), indium gallium nitride (InGaN)-aluminum gallium nitride (AlGaN), silicon-silicon carbide (Si_(x)C_(1-x)) and silicon-SiGe heterojunction semiconductor materials. For power semiconductor applications currently mainly Si, SiC, GaAs and GaN materials are used. If the semiconductor body comprises a high band gap material such as SiC or GaN which has a high breakdown field strength and high critical avalanche field strength, respectively, the doping of the respective semiconductor regions can be chosen higher which reduces the on-state resistance Ron in the following also referred to as on-resistance Ron.

With reference to FIG. 1, a first embodiment of field-effect semiconductor device 100 is explained. FIG. 1 illustrates a vertical cross-section through a semiconductor body 40 of the semiconductor device 100. The semiconductor body 40 extends between a first side, typically a flat first surface 101, facing a vertical direction, and second side, typically a flat second surface (back surface) 102 arranged opposite to the first surface 101. In a horizontal direction that is substantially parallel to the first surface 101, the semiconductor body 40 is delimited by an edge or kerf 41, for example a sawing edge, which is substantially orthogonal to the first surface 101. In the following, the edge 41 is also referred to as lateral edge 41. The semiconductor body 40 has an active area 120 and a peripheral area 110 arranged between the active area 120 and the edge 41. Typically, the peripheral area 110 surrounds the active area 110 when seen from above.

The semiconductor body 40 includes a mono-crystalline drift region 1 of a semiconductor material, such as silicon, doped with first dopants (dopants of a first conductivity type) typically providing a first number of first free charge carriers per unit in the semiconductor material. In the exemplary embodiment, drift region 1 is n-type, i.e. doped with n-type dopants. For example, the semiconductor material may be silicon and the n-type dopants may be electrically active phosphorous or arsenic impurities providing one free electron per unit.

The semiconductor body 40 typically includes a bulk mono-crystalline substrate of the semiconductor material at the first surface 101 and at least one layer, typically at least one epitaxial layer of the same semiconductor material formed thereon and extending to the second surface 102. Using the epitaxial layer(s) provides more freedom in tailoring the background doping of the material since the doping concentration can be adjusted during deposition of the epitaxial layer or layers.

A p-type body layer 5 forming a pn-junction with the drift region 1 is arranged between the drift region 1 and the second side 102.

A source metallization 10 and in Ohmic connection with the drift region 1 is arranged on the second side 102. As illustrated in FIG. 1, the source metallization 10 may substantially or completely cover the second side 102.

A drain metallization 11 in Ohmic connection with the drift region 1 is arranged on the first side 102, i.e. opposite to the source metallization 10.

In the exemplary embodiment, the drain metallization 11 completely covers an active area 110 and partly extends into a peripheral area 110 typically surrounding the active area 120 when seen from above.

As illustrated in FIG. 1, the drift region 1 may include an upper sub-layer 3 of the same or a higher doping concentration. Further, a highly n-doped drain and/or a highly n-doped drain field-stop layer are typically arranged between said drift region and the drain metallisation 10.

Typically, the semiconductor device 100 includes an n-type drain- and field-stop layer 4 including a field-stop region 4 b having a higher doping concentration than the drift region 1, and a drain region 4 a having a higher doping concentration than the field-stop region 4 b and arranged between the field-stop layer 4 b and the drain metallization 11.

At least the drain region 4 b may extend to the first side 101 and is typically in Ohmic contact with drain metallisation 10.

In the active area 120, a plurality of gate electrodes 12 is arranged next to the second side 102 and electrically insulated from the semiconductor body 40 by respective gate dielectric regions 13 c. Accordingly, respective operable switchable channel regions may be formed in the body layer 5 for providing low Ohmic connections between the source metallization 10 and the drift region 1, and thus between the source metallization 10 and the drain metallization 11 in the illustrated exemplary embodiment of an n-channel MOSFET, in a forward mode of the field-effect semiconductor device 100.

In embodiments referring to p-channel MOSFET, the doping relations are reversed.

As illustrated in FIG. 1, the body layer 5 may, in the active area 120, be spaced apart from the second side 102 by a typically highly n-doped source layer 2 forming a further pn-junction with the body layer 5, in Ohmic connection with the source metallization 10 and typically arranged at the second side 102.

The gate electrodes 12 and the switchable channel regions may define the active area 120. The active area 120 may also be defined by the presence of source regions and/or by the presence of active cells, e.g. MOSFET-cells, for carrying a load current between the source metallization 10 and the drain metallization 11.

In the exemplary embodiment, the gate electrodes 12 are implemented as trench gate electrodes, i.e. as electrodes that are arranged in respective trenches extending from the second side 102 through the body layer 5 into the drift region 1.

Accordingly, the source layer 2 and the body layer 5 are, in the shown vertical cross-section, separated by the trench gate electrodes 12 into respective portions forming source regions and the body regions, respectively.

In other embodiments, the gate electrodes are arranged on the second side 102.

The body layer 5 is typically arranged at the second side 102, at least in the peripheral area 110.

In the exemplary embodiment, the proportions of the source layer 2 and the body layer 5 are in Ohmic connection with the source metallisation 10 via source contacts 10 c that may be implemented as shallow trench contacts formed through a dielectric layer 13 arranged at the second side 102, and between the second side 102 and the source metallisation 10. In the following, the dielectric layer 13 is also referred to as second dielectric layer. The source contacts 10 c may e.g. be formed by doped poly-silicon regions. In other embodiments, the source metallization 10 electrically contacts the source regions and the body regions substantially at the first side 101.

Further, higher p-doped body contact regions (not shown) may be arranged between the source contacts 10 c and the body regions and between the source metallization 10 and the body regions, respectively.

The gate electrodes 12 are connected to a gate metallization 12 a, 12 p typically forming a gate pad 12 p that is arranged in the peripheral area 110 at the first side 101, via a first through contact structure 12 c, 14 extending in the peripheral area 110 between the first side 101 and the second side 102. Accordingly, the semiconductor device 100 may be operated as a three-terminal device (source-down MOSFET).

The first through contact structure 12 c, 14 may be formed by conductive region 12 c such as poly-Si in Ohmic connection with the gate electrode 12 via a wiring 41 next to the second side 102, and a dielectric layer 14 electrically insulating the conductive region 12 c from the semiconductor body 40. For sake of clarity, the wiring 41, which may be implemented as conducting paths of e.g. poly-Si, is only schematically indicated in FIG. 1.

In the exemplary embodiment, the first through contact structure 12 c, 14 is formed in a vertical trench 51 extending from the first side 101 to the second side 102 and through a p-type field-stop region 5 a in Ohmic connection with the body layer 5.

When seen from above and in normal projections onto horizontal planes h which are at least substantially parallel to the first side 101, respectively, the p-type field-stop region 5 a typically at least substantially surrounds the drift region 1 and the gate electrodes 12.

Accordingly, the electric field lines 25 in a blocking mode of the semiconductor device 100, in which the pn-junction between the drift region 1 and the body layer 5 is reversely biased, can be bent reliably away from the edge 41 at least towards the first side 101.

This ensures a particular high breakdown voltage. The electric field lines 25 may even cross the first side 101 substantially perpendicular as illustrated in FIG. 1. Further, manufacturing of the semiconductor device 100 is facilitated. For example, structuring of the first side 101 (backside of the wafer) may be achieved with a low thermal budget. This is explained in more detail below with regard to FIG. 7A to FIG. 21.

Different to the p-type field-stop region 5 a, the first through contact structure 12 c, 14 does typically not surround the drift region 1 and the gate electrodes 12 when seen from above.

Further, when seen from above, the area of the first through contact structure 12 c, 14 is typically at least one order of magnitude lower than the area the p-type field-stop region 5 a.

The p-type field-stop region 5 a may be at least substantially (e.g. neglecting the trench for the first through contact structure 12 c, 14 shaped as a hollow cylinder), typically as a right hollow cylinder. The term hollow cylinder as used herein is to be understood as a body with an inner and an outer surface shell each of which is a ruled surface spanned by a family of parallel lines. The term circular hollow cylinder shall include circular hollow cylinder, elliptic hollow cylinder but also hollow prism.

The vertical extension of the field-stop region 5 a is typically at least about 70%, at least about 75% or even least about 80% of a distance between the first side 101 and the second side 102.

The body layer 5 may have a higher doping concentration than the field-stop region 5 a. However, it is rather the integrated dopant concentration than the volume specific doping concentration that determines the function of the p-type field-stop region 5 a. Accordingly, the volume specific doping concentration of the field-stop region 5 a is typically higher for p-type field-stop region 5 a of lower (horizontal) wall thickness.

As illustrated in FIG. 1, a p-type JTE-region (junction extension termination region) 5 b having a different doping concentration than the field-stop region 5 a may be arranged in the peripheral area 110, and between the p-type field-stop region 5 a and the first side 101.

The p-type JTE-region 5 b is typically also substantially shaped as a hollow cylinder and may surround the drift region 1 and the drain- and field-stop layer 4 when seen from above.

Further, the p-type JTE-region 5 b may extend to the drain- and field-stop layer 4.

In the exemplary embodiment, the p-type semiconductor structure 5, 5 a, 5 b formed by the field-stop region 5 a, the adjoining body layer 5 and the p-type JTE-region 5 b act as an embedding p-well at source potential for the drift region 1 during device operation.

The p-type semiconductor structure 5, 5 a, 5 b typically extends from the first side 101 to the second side 102. The p-type semiconductor structure 5, 5 a, 5 b may however only substantially extend from the first side 101 to the second side 102, i.e. the vertical extension of the p-type semiconductor structure 5, 5 a, 5 b corresponds to at least about 80%, more typically at least about 90%, even more typically at least about 95% or even 97% of the distance between the first side 101 and the second side 102.

Alternatively, the JTE-region 5 b may be slightly n-doped or a substantially intrinsic semiconductor region. In these embodiments, the p-type semiconductor structure is formed by the field stop region 5 a and/or outer portions of the body layer arranged in the peripheral area 110.

As further illustrated in FIG. 1, the gate metallization 12 a, 12 p is arranged on a dielectric layer 15 arranged on the first side 101 protecting the semiconductor body 40 at the first side 101 and insulating the gate metallization 12 a, 12 p from the semiconductor body 40. In the following the dielectric layer 15 is also referred to as first dielectric layer. Further, the dielectric layer 15 may act as field oxide or field dielectric for field plate portions 11 a, 12 a of the drain metallization 11 and the gate metallization, respectively. The field plate portions 11 a, 12 a form additional equipotential region (edge termination) structures in the peripheral area 110 to facilitate guiding the electric field lines 25 through the first side 101.

Typically, the field plate portions 11 a, 12 a surround the active area 120 when seen from above.

The drain field plate 11 a and/or the gate field plate 12 a may be stepped, i.e., the vertical (minimum) distance of the field plates 11 a and/or 12 a from the first side 101 may change substantially stepwise in horizontal direction. In other embodiments, only one or even none of the field plate 11 a, 12 a is arranged on the first side 101.

In the exemplary embodiment, the dielectric layer 15 has two openings, namely a central first opening filled with a central portion of the drain metallisation 11 and second opening formed in the peripheral area 110 for contacting the gate pad 12 p and the conductive region 12 c of the first through contact structure 12 c, 14.

One or both of the dielectric layers 13, 15 may substantially extend to the edge 41.

In the illustrated vertical cross-section of FIG. 1, compensation regions 6 alternate with portions 1 of the drift region 1 both in the active area 120 and in the peripheral area 110. The compensation regions 6 are typically made of the same semiconductor material as the drift region 1 but are doped with second dopants (dopants of a second conductivity type opposite to the first conductivity type) providing a second number of free second charge carriers per unit in the semiconductor material.

In the exemplary embodiment, compensation regions 6 are p-type, i.e. doped with p-type dopants. For example, the semiconductor material may be silicon and the p-type dopants may be electrically active boron impurities providing one free hole per unit in silicon.

Typically, a plurality, e.g. more than ten, of alternating n-type drift portions 1 and p-type compensation regions 6 forming respective pn-junctions with each other are arranged in the active area 120.

In the vertical cross-section, the p-type compensation regions 6 may be formed as vertically orientated pillars, substantially vertically orientated strip-type parallelepipeds, rectangles or ellipsoids.

In the following, the n-type drift portions 1 are also referred to as n-type pillar regions 1 and first pillar regions 1 (of the first conductivity type), respectively, and the p-type compensation regions 6 are also referred to as p-type pillar regions 6 and second pillar regions 6′ (of the second conductivity type), respectively.

The p-type compensation regions 6 may be formed in trenches 50 extending from the first side 101 into the semiconductor body 40 by selective epitaxial deposition.

In the exemplary embodiment, the compensation regions 6 have in the active area 120 and the peripheral area 110 the same horizontal pitch.

The term “pitch” as used within this specification intends to describe a distance between repeated elements in a structure possessing translational symmetry and typically corresponds to length of a primitive axis (vector) of the structure and length of a base vector of a regular lattice, respectively.

Furthermore, the compensation regions 6 in the active area 110 and the compensation regions 6 in the peripheral area 120 may have the same vertical extension.

At least the compensation regions 6 of the active area 120 are in Ohmic connection with the source metallization 10, typically via the higher p-doped body layer 5 arranged between the compensation regions 6 and the second side 102 and/or via the source contacts 10 c.

According to an embodiment, the doping concentrations of the compensation regions 6 and the drift portions 1 are chosen such that, in the off-state, their charges can be mutually depleted and that, in the on-state, an uninterrupted, low-resistive conduction path is formed from the source metallization 10 to the drain metallization 11.

A total number of free electrons provided by n-type dopants typically substantially matches a total number of free holes provided by p-type dopants at least in the active area 120. Typically, the total number of free electrons provided by the n-type dopants varies by less than 5%, more typically less than 1% from the total number of free holes provided by the p-type dopants. Accordingly, the drift portions 1 and the first compensation regions 6 form a pn-compensation structure 1, 6.

FIG. 2 illustrates a vertical cross-section through a semiconductor body 40 of a field-effect semiconductor device 100 a. The field-effect semiconductor device 100′ is similar to the semiconductor device 100 explained above with regard to FIG. 1, and is also implemented as charge-compensation MOSFET.

However, the conductive region 12 c of the first through contact structure 12 c, 14 extends through the dielectric layer 15. Accordingly, opening the dielectric layer 15 from the first side 101 may be avoided during manufacturing. This is explained in more detail below. Note that opening the dielectric layer 15 from the first side 101 requires a comparatively high accuracy. Otherwise, an undesired Ohmic connection may be formed between the gate pad 12 p and the semiconductor body 40.

FIG. 3 illustrates a vertical cross-section through a semiconductor body 40 of a field-effect semiconductor device 200. The field-effect semiconductor device 200 is similar to the semiconductor device 100 explained above with regard to FIG. 1.

However, the compensation regions 6 of the field-effect semiconductor device 200 are spaced apart from the drain- and field-stop layer 4 by a current-spread portion of the drift region 1, 3.

The contact between the conductive region 12 c of the first through contact structure 12 c, 14 and the gate pad 12 p of the semiconductor device 200 may also be implemented as explained above with regard to FIG. 2.

FIG. 4 illustrates a vertical cross-section through a semiconductor body 40 of a field-effect semiconductor device 300. The field-effect semiconductor device 300 is similar to the semiconductor device 200 explained above with regard to FIG. 2.

However, the semiconductor device 300 is a silicon-on-insulator (SOI)—device manufactured using an SOI-wafer with a buried oxide layer forming the second dielectric layer 13 in the manufactured device 300.

Accordingly, a further semiconductor layer 7 may be arranged between the source metallization 10 and the second dielectric layer 13. In this embodiment, the source contacts 10 c typically extend to the source metallization 10.

The contact between the conductive region 12 c of the first through contact structure 12 c, 14 and the gate pad 12 p of the semiconductor device 300 may also be implemented as explained above with regard to FIG. 2.

Further, a second through contact structure 10 c′, 14 a extends in the peripheral area 110 of the semiconductor device 300 from the first side 101 to the source metallization 10 and through the field-stop region 5 a. The second through contact structure 10 c′, 14 a is formed in a second deep trench 51 a and includes a dielectric layer 14 a arranged at the sidewall of the trench 51 a and a conductive region 10 c′ providing an Ohmic connection between the source metallization 10 on the second side 102 and a source pad 10 p on the first side 101. Similar as explained for the first through contact structure 12 c, 14, the dielectric layer 14 a separates the conductive region 10 c′ from the semiconductor body 40.

As illustrated in FIG. 4, a source field plate 10 a in Ohmic connection with the source metallization 10 may additionally be arranged on the first side 101, and arranged between the source pad 10 p and the drain metallization 11.

The source field plate 10 a and the source pad 10 p are typically formed by a contiguous region.

FIG. 5 illustrates a vertical cross-section through a semiconductor body 40 of a field-effect semiconductor device 500. The field-effect semiconductor device 500 is similar to the semiconductor device 300 explained above with regard to FIG. 4.

However, the source field plate 10 a and the source pad 10 p of the peripheral area 110 of the semiconductor device 500 are in Ohmic connection with the source metallization 10 via an n-type contact region 8 arranged between the left lateral edge 41 and the p-type field-stop region 5 a and a further source contact 10 c″ extending from the source metallization 10 at least to the contact region 8.

The contact between the conductive region 12 c of the first through contact structure 12 c, 14 and the gate pad 12 p of the semiconductor device 500 may also be implemented as explained above with regard to FIG. 2.

FIG. 6 illustrates a vertical cross-section through a semiconductor body 40 of a field-effect semiconductor device 600. The field-effect semiconductor device 600 is similar to the semiconductor device 500 explained above with regard to FIG. 5.

However, there is no gate field plate formed on the first side 101. Instead, the source field plate 10 a surrounds the active area 120 of semiconductor device 600 when seen from above. Note that the voltage difference between gate- and source potential is with respect to blocking voltage of minor importance for high voltage semiconductor device.

Further, the source field plate 10 a and the source pad 10 p are connected with the source metallization 10 via the field-stop region 5 a, the JTE-region 5 b and the further source contact 10 c″.

Further, the first through contact structure 12 c, 14 is formed in trench 51 which extends through a typically low doped n-type edge region 8 a arranged in the vertical cross-section between the lateral edge 41 and the p-type field-stop region 5 a.

Even further, there may be only a few, only one or even no compensation regions 6 formed in the peripheral area 110 of the semiconductor device 600.

The field-effect semiconductor devices 100 to 600 may also be described as source-down semiconductor devices, in particular as source-down charge-compensation semiconductor devices (source-down super-junction semiconductor devices), having a drift region 1 of a first conductivity type, an embedding semiconductor structure 5, 5 a, 5 b of a second conductivity type for the drift region, and a first through contact structure 12 c, 14. The embedding semiconductor structure 5, 5 a, 5 b extends at least substantially extending from a first side 101 to a second side 102 of a semiconductor body 40 in which the drift region 1 and the embedding semiconductor structure 5, 5 a, 5 b are formed. The first through contact structure 12 c, 14 extends between the first side 101 and the second side 102, and includes a conductive region 12 c in Ohmic connection with gate electrodes 12 overlapping, in a normal projection onto horizontal planes h parallel to at least one of the first side 101 and the second side 102, with the drift region 1 and arranged next to the second side 102, and a dielectric layer 14 electrically insulating the conductive region 12 c from the semiconductor body 40. At least a portion of the semiconductor structure 5, 5 a, 5 b is, in the normal projection, arranged between the first through contact structure 12 c, 14 and the gate electrodes 12.

In the following, manufacturing methods for those devices are explained.

Charge-compensation semiconductor devices may be produced with a so-called ‘multiple epitaxy’ process. In this case, an n-doped epitaxial layer, which may be several μm thick, is first grown on a highly n-doped substrate and commonly referred to as ‘buffer epi’. In addition to a doping level introduced in the epitaxial step doping ions are introduced into the buffer epi through a mask using implantation with the doping ions in the first charging locations (for example boron for phosphorous doping). Counter doping can be also employed with implantation (either through a mask, or on the entire surface). However, it is also possible to separate the individual epitaxial layers with the required doping. After that, the entire process is repeated as much time as required until an n (multi-epitaxial) layer is created which has a sufficient thickness and which is equipped with charge centers. The charge centers are mutually adjusted to each other and vertically stacked on top of each other. These centers are then merged with outward thermal diffusion in an undulating, vertical column to form adjacent p-type charge-compensation regions (compensation regions) and n-type charge-compensation regions (drift portions). The manufacturing of the actual devices can then be conducted at this point.

Another technique for fabricating charge-compensation semiconductor devices involves trench etching and compensation with trench filling. The volume which absorbs the voltage is deposited in a single epitaxial step (n-doped epi) on a highly n-doped substrate, so that the thickness corresponds to the total thickness of the multilayered epitaxial structure. After that, deep trenches are etched, which determine the form of the p-columns (compensation regions). The deep trenches are then filled with p-doped epi which is at least substantially free of crystal defects.

Both techniques may be used to manufacture the charge-compensation semiconductor devices as explained above with regard to FIGS. 1 to 6.

With regard to FIG. 7A to FIG. 21 exemplary method steps of methods for manufacturing a charge-compensation semiconductor devices 700, 700 a are explained in respective vertical cross-sections with respect to the ‘multiple epitaxy’ process.

In a first step, a wafer 30 may be provided. As illustrated in FIG. 7A, the wafer may be a SOI-wafer with an upper semiconductor layer 1 a forming an interface 101 with a buried oxide layer 15 sandwiched between the upper semiconductor layer 1 a and a lower semiconductor layer 7.

The upper semiconductor layer 1 a and/or the lower semiconductor layer 7 may be respective silicon layers.

The buried oxide layer 15 may be a thermal oxide layer, e.g. having a vertical thickness of about 1 μm to about 5 μm.

The upper semiconductor layer 1 a may have a vertical thickness of less than a few micrometers.

In the exemplary embodiment, the upper semiconductor layer 1 a and the lower semiconductor layer 7 are (slightly) n-doped. The doping relations illustrated in Figures may however also be reversed.

Thereafter, active device areas 121 which are surrounded by corresponding peripheral device areas 110 may be defined.

Thereafter, n-type dopants may be implanted into the upper semiconductor layer 1 a to form a seed-layer 4′ for a drain- and field-stop layer, and p-type dopants may be implanted into the upper semiconductor layer 1 a in the peripheral area to form respective seed-layers 5′, 5″ for a JTE-region and a field-stop region. The resulting semiconductor structure 700 is illustrated in FIG. 7B.

Thereafter, a first epitaxial semiconductor layer 1 e may be deposited on the upper layer 1 a. The resulting semiconductor structure 700 is illustrated in FIG. 8A.

As illustrated in FIG. 8B, a subsequent thermal process may be used to activate and potentially drive in the implanted ions. Accordingly, the n-type drain- and field-stop layer 4, the p-type JTE-region 5′ and a portion 5 a′ of the field-stop region may be formed.

Thereafter, several sequences of epitaxial depositing the first semiconductor material (e.g. Si) and masked implantation and a further thermal process may be used to form the field-stop region 5 surrounding a charge-compensation structure having a plurality of compensation regions 6 which are spaced apart from each other and form respective pn-junctions with the drift region 1. The resulting semiconductor structure 700 is illustrated in FIG. 9.

Thereafter, an uppermost semiconductor layer 2, 5 extending to an upper side 102 of a semiconductor body 40 and a front-side 102 of the wafer 30, respectively, may be formed on the buried oxide layer 15 using epitaxial deposition.

Thereafter, further implantation(s) and a further thermal process may be used to form a body layer 5 and a source layer 2 in the uppermost semiconductor layer 2, 5. The resulting semiconductor structure 700 is illustrated in FIG. 10.

The method steps explained so far may also be described as providing a wafer 30 with a semiconductor body 40 having a first side 101 and a second side 102 opposite the first side 101, and including a drift region 1 of a first conductivity type and a semiconductor structure 5, 5 a of a second conductivity type extending from the first side 101 to the second side 102, and surrounding the drift region 1 in a normal projection onto a horizontal plane substantially parallel to the first side 101.

Thereafter, a first deep trench 51 may be etched in the peripheral area from the second side 102 to the dielectric layer 15. For this purpose a resist mask (not shown) may be formed at the second side 102. The dielectric layer 15 may be used as etch-stop.

In the exemplary embodiment illustrated in FIG. 11, the first deep trench 51 is completely etched through the body layer 5 and the p-type field-stop region 5 a.

The first deep trench 51 may e.g. have a circular shape when seen from above.

In the exemplary embodiment, the first deep trench 51 is surrounded by the body layer 5 and the p-type field-stop region 5 a when seen from above.

Thereafter, a dielectric sidewall layer 14 may be formed at a sidewall of the first deep trench 51. This may e.g. be achieved by thermal oxidation.

Thereafter, the first deep trench 51 may be filled with a conductive material such as doped poly-Si to form a conductive region 12 c extending along the sidewall layer 14. This may be achieved by depositing and a subsequent polishing at the second side 102, e.g. a CMP-process (Chemical-Mechanical Polishing). The resulting semiconductor structure 700 is illustrated in FIG. 12.

As illustrated in FIG. 13, a second etching process may be used for etching through the dielectric layer 15. Thereby, a deepened first deep trench 51′ may be formed.

Thereafter, a conductive region 12 c surrounded by a dielectric sidewall layer 14 may be formed in the deepened first deep trench 51′. This may be achieved similar as explained above with regard to FIG. 12. However, the conductive region 12 c of the resulting semiconductor structure 700 a illustrated in FIG. 14 extends through the dielectric layer 15. This facilitates later contacting (to a gate pad). Except for said later contacting, the subsequent processes for forming the devices 700, 700 a are similar. For sake of clarity, these processes are mainly explained with regard to semiconductor structure 700.

After or prior to forming the first through contact structure 12 c, 14, a plurality of insulated gate electrodes may be formed next to the second side 102 in the active device area(s).

As illustrated in FIG. 15, this may include etching shallow trenches 52 from the second side 102 through the source layer 2 and the body layer 5 partially into the drift region 1.

Thereafter, gate dielectrics regions 13 c may be formed at the side—and bottom walls of the shallow trenches 52.

Thereafter, the shallow trenches 52 may be filled with a conductive material such as doped poly-Si to form the gate electrodes 12.

Further, a wiring 41 may be formed between the conductive region 12 c in the first deep trench 51 and the gate electrodes 12.

Thereafter, a second dielectric layer 13 may be formed on the second side 102. Forming the second dielectric layer 13 typically includes depositing a dielectric layer. The resulting semiconductor structure 700 is illustrated in FIG. 16.

Thereafter, shallow trenches 53 may be etched through the second dielectric layer 13.

As illustrated in FIG. 17, the shallow trenches 53 may extend into the compensation regions 6.

Thereafter, the shallow trenches 53 may be filled with a conductive material such as doped poly-Si to form source contacts 10 c.

After subsequent forming a first metallization 10, typically forming a source metallization, on the dielectric layer 13 (on the second side 102), device processing from the second side 102 may be finished. Forming the first metallization 10 typically includes depositing a highly conductive material. The resulting semiconductor structure 700 is illustrated in FIG. 18.

Thereafter, the wafer 30 may be mounted upside down.

FIG. 19 illustrates the resulting semiconductor structure 700 after further removing the semiconductor layer 7. This may be achieved by grinding.

Alternatively, the semiconductor layer 7 is only partly removed (thinned).

Thereafter, masked etching may be used to form a first opening 17 in the first dielectric layer 15 in the active area and a second opening 18 in the first dielectric layer 15 in the peripheral area.

As illustrated in FIG. 20, the first opening 17 exposes the semiconductor body 40 at the first side 101.

Further, the second opening 18 exposes the conductive region 12 c of the first deep trench 51 at the first side 101.

Forming the second opening 18 in the dielectric layer 15 can be omitted if the conductive region 12 c extends through the dielectric layer 15 as explained above with regard to FIG. 14. In these embodiments, a larger process variability for forming the first opening 17 is tolerable.

Thereafter, a conductive layer may be deposited on the first side 101.

Further, the conductive layer may be etched using a mask to form a second metallization 11 (typically a drain metallization) and a gate metallization 12 a, 12 p on the first side 101.

Thereafter, the wafer 30 may be separated, e.g. by sawing along sawing or scribe lines 41, into individual charge-compensation semiconductor devices, so that the charge-compensation semiconductor devices have a corresponding lateral edge 41 which delimits the charge-compensation semiconductor device 700 in a horizontal direction substantially parallel to the first side 101.

After further separating the wafer 30 into individual chis, charge-compensation semiconductor devices 700 as illustrated in FIG. 21 may be obtained.

Although various exemplary embodiments of the invention have been disclosed, it will be apparent to those skilled in the art that various changes and modifications can be made which will achieve some of the advantages of the invention without departing from the spirit and scope of the invention. It will be obvious to those reasonably skilled in the art that other components performing the same functions may be suitably substituted. It should be mentioned that features explained with reference to a specific figure may be combined with features of other figures, even in those cases in which this has not explicitly been mentioned. Such modifications to the inventive concept are intended to be covered by the appended claims.

Spatially relative terms such as “under”, “below”, “lower”, “over”, “upper” and the like are used for ease of description to explain the positioning of one element relative to a second element. These terms are intended to encompass different orientations of the device in addition to different orientations than those depicted in the figures. Further, terms such as “first”, “second”, and the like, are also used to describe various elements, regions, sections, etc. and are also not intended to be limiting. Like terms refer to like elements throughout the description.

As used herein, the terms “having”, “containing”, “including”, “comprising” and the like are open ended terms that indicate the presence of stated elements or features, but do not preclude additional elements or features. The articles “a”, “an” and “the” are intended to include the plural as well as the singular, unless the context clearly indicates otherwise.

With the above range of variations and applications in mind, it should be understood that the present invention is not limited by the foregoing description, nor is it limited by the accompanying drawings. Instead, the present invention is limited only by the following claims and their legal equivalents. 

What is claimed is:
 1. A field-effect semiconductor device, comprising: a semiconductor body comprising: a first side; a second side opposite the first side; an n-type drift region; a p-type body layer forming a pn-junction with the drift region and arranged at the second side; and a p-type field-stop region in Ohmic connection with the body layer; a source metallization arranged on the second side and in Ohmic connection with the body layer; a drain metallization arranged on the first side and in Ohmic connection with the drift region; a gate electrode arranged adjacent to the second side and electrically insulated from the semiconductor body to define an operable switchable channel region in the body layer for providing an Ohmic connection between the source metallization and the drift region; a first through contact structure extending at least between the first side and the second side, and comprising a conductive region in Ohmic connection with the gate electrode, and a dielectric layer electrically insulating the conductive region from the semiconductor body; and a gate metallization arranged on the first side and in Ohmic connection with the conductive region, wherein in a normal projection onto a horizontal plane substantially parallel to the first side, the field-stop region surrounds at least one of the drift region and the gate electrode.
 2. The field-effect semiconductor device of claim 1, wherein the field-effect semiconductor device has a rated breakdown voltage of at least 100 V, wherein the field-effect semiconductor device is a charge-compensation semiconductor device, wherein the semiconductor body comprises compensation regions each of which adjoins the body layer and forms a respective pn-junction with the drift region, wherein the field-stop region surrounds the compensation regions in the normal projection onto the horizontal plane, and/or wherein the compensation regions form a lattice.
 3. The field-effect semiconductor device of claim 1, wherein the field-stop region has a lower doping concentration than the body layer, and/or wherein the field-stop region has, in a vertical direction perpendicular to the horizontal plane, a vertical extension which is at least about 70% of a distance between the first side and the second side.
 4. The field-effect semiconductor device of claim 1, wherein the first through contact structure extends through the field-stop region, wherein the first through contact structure adjoins the field-stop region, wherein at least a portion of the field-stop region is, in the normal projection onto the horizontal plane, arranged between the first through contact structure and at least one of the drift region and the gate electrode, wherein the first through contact structure does not surround the gate electrode in the normal projection onto the horizontal plane, and/or wherein the conductive region extends through a dielectric layer arranged on the first side.
 5. The field-effect semiconductor device of claim 1, wherein the gate metallization comprises at least one of a gate pad portion and a gate field plate portion arranged between the gate pad portion and the drain metallization, and/or wherein the field-effect semiconductor device further comprises at least one of a source pad arranged on the first side and in Ohmic connection with the source metallization, and a source field plate arranged on the first side, in Ohmic connection with the source metallization, and arranged between the source pad and the drain metallization.
 6. The field-effect semiconductor device of claim 1, further comprising at least one of: a second through contact structure extending from the first side to the source metallization and comprising a conductive region in Ohmic connection with the source metallization and a dielectric layer separating the conductive region from the semiconductor body; an n-type contact region arranged, in a vertical cross-section perpendicular to the first side, between a lateral edge delimiting the semiconductor body in a horizontal direction substantially parallel to the first side and the p-type field-stop region, and in Ohmic connection with the source metallization or the gate metallization; and an n-type edge region arranged in the vertical cross-section between the lateral edge and the p-type field-stop region.
 7. The field-effect semiconductor device of claim 1, further comprising an n-type field-stop region having a higher doping concentration than the drift region and arranged between the drift region and the drain metallization.
 8. The field-effect semiconductor device of claim 1, further comprising a p-type JTE-region having a lower doping concentration than the field-stop region, wherein the JTE-region extends from the field-stop region to the first side, wherein the JTE-region extends from the drift region to the first side, and/or wherein the JTE-region at least substantially surrounds the n-type field-stop region in the normal projection on the horizontal plane.
 9. A field-effect semiconductor device, comprising: a semiconductor body comprising: a first side; a second side opposite the first side; a semiconductor structure of a second conductivity type at least substantially extending from the first side to the second side; and a drift region of a first conductivity type arranged, in a vertical cross-section substantially perpendicular to the first side, between two portions of the semiconductor structure; a first metallization arranged on the second side and in Ohmic connection with the semiconductor structure; a second metallization arranged on the first side and in Ohmic connection with the drift region; a plurality of gate electrodes arranged adjacent to the second side, overlapping with the drift region in a normal projection onto a horizontal plane substantially parallel to the first side, and electrically insulated from the semiconductor body; a first through contact structure extending at least between the first side and the second side, and comprising a conductive region in Ohmic connection with the gate electrodes, and a dielectric layer electrically insulating the conductive region from the semiconductor body so that at least a portion of the semiconductor structure is, in the normal projection onto the horizontal plane, arranged between the first through contact structure and the gate electrodes; and a gate pad arranged on the first side and in Ohmic connection with the conductive region.
 10. The field-effect semiconductor device of claim 9, wherein the field-effect semiconductor device has a rated breakdown voltage of at least 100 V, wherein the field-effect semiconductor device is a charge-compensation semiconductor device, and/or wherein the semiconductor body comprises a plurality of compensation regions which are spaced apart from each other, form respective pn-junctions with the drift region, form a lattice, and/or are surrounded by the semiconductor structure in the normal projection onto the horizontal plane.
 11. The field-effect semiconductor device of claim 9, wherein the semiconductor structure comprises at least one of: a field-stop region of the second conductivity type having in a vertical direction substantially perpendicular to the first side an extension which is at least about three quarters of a distance between the first side and the second side; a body layer of the second conductivity type having a higher doping concentration than the field-stop region, arranged at the second side and forming a pn-junction with the drift region; and a JTE-region of the second conductivity type having a different doping concentration than the field-stop region.
 12. The field-effect semiconductor device of claim 11, wherein the field-stop region surrounds the drift region in the normal projection on the horizontal plane, wherein the field-stop region extends from the body layer at least close to the first side, wherein the field-stop region has a lower doping concentration than the body layer, and/or wherein the field-stop region has, in a vertical direction perpendicular to the horizontal plane, a vertical extension which is at least about 70% of a distance between the first side and the second side, typically at least about 75% of the distance between the first side and the second side.
 13. The field-effect semiconductor device of claim 9, further comprising a dielectric layer arranged on the first side and comprising a first opening which overlaps with the drift region and a second opening which overlaps with the conductive region of the first through contact structure in the normal projection onto the horizontal plane.
 14. The field-effect semiconductor device of claim 9, further comprising a source layer forming a further pn-junction with the body layer and arranged at the second side.
 15. A method for forming a field-effect semiconductor device, the method comprising: providing a wafer comprising: a semiconductor body having a first side and a second side opposite the first side, and comprising a drift region of a first conductivity type and a semiconductor structure of a second conductivity type extending from the first side to the second side, and surrounding the drift region in a normal projection onto a horizontal plane substantially parallel to the first side; and a first dielectric layer arranged at the first side; forming a first deep trench from the second side at least to the dielectric layer; forming a dielectric sidewall layer at a sidewall of the first deep trench; forming a conductive region at the sidewall layer in the first deep trench; forming a plurality of gate electrodes adjacent to the second side and overlapping with the drift region in the normal projection onto the horizontal plane; forming a first metallization on the second side and in Ohmic connection with the semiconductor structure; and forming, opposite to the first metallization, a second metallization in Ohmic connection with the drift region and a gate metallization in Ohmic connection with the conductive region.
 16. The method of claim 15, wherein providing the wafer comprises at least one of: providing a silicon-on-insulator wafer comprising an upper semiconductor layer of a first semiconductor material extending to the first side, a buried oxide layer forming the first dielectric layer, and a lower semiconductor layer arranged below the first dielectric layer; implanting p-type dopants into the upper semiconductor layer; implanting n-type dopants into the upper semiconductor layer; and epitaxial depositing the first semiconductor material.
 17. The method of claim 16, wherein the second metallization and the gate metallization are formed after forming the first metallization, and/or wherein forming the second metallization and the gate metallization comprises at least one of: thinning the lower semiconductor layer; masked etching the first dielectric layer; forming a first opening in the first dielectric layer to expose the semiconductor body at the first side; forming a second opening in the first dielectric layer to expose the conductive region in the first deep trench; depositing a conductive layer; and masked etching the conductive layer.
 18. The method of claim 15, prior to forming the first metallization further comprising at least one of: forming from the second side a second deep trench at least to the dielectric layer; forming a dielectric sidewall layer at a sidewall of the second deep trench; forming a conductive region at the sidewall layer in the second deep trench; forming on the second side a wiring between the conductive region in the first deep trench and the gate electrodes; forming a second dielectric layer on the second side; and etching shallow trenches through the second dielectric layer prior to forming the first metallization.
 19. The method of claim 15, further comprising: forming a body layer of the second conductivity type on the drift region and in Ohmic connection with the first metallization; forming a source region of the first conductivity type at the body layer and in Ohmic connection with the first metallization; and forming a plurality of compensation regions which are spaced apart from each other and form respective pn-junctions with the drift region.
 20. The method of claim 15, wherein forming the first deep trench comprises at least one etching process, wherein the first deep trench is etched through the semiconductor structure, and/or wherein the first deep trench is etched through the through the dielectric layer. 